MERLIN

Smart wireless MID sensor systems for IoT applications

MERLIN is a cross-division project incorporating the wireless sensor network solution nexy and steute Meditec. It aims to develop 3D-printed sensors for individual integration of machines, devices and applications in the loT (Internet of Things). This is to be achieved by combining and synergising the technology fields Additive Manufacturing (AM) and Mechatronic Integrated Devices (MID). The project began in March 2021.

The main objective of the project is to analyse and characterise the new uses for AM-MID applications, as well as to overcome the existing discrepancy between the demand for individual sensors and the networking solutions which are currently available. As part of this project, steute is researching practical uses for integrated antennas in various application fields.

Taking initial results, particular schemata are analysed for pointers regarding design, production-relevant restrictions and partial solutions. Based on this content, specific demonstrators are then validated. This procedure guarantees optimal understanding of the process involved. At the same time, it develops a system which can help other companies access the technology, while keeping manufacturing costs at a reasonable level.

Watch our virtual presentation for more information about MERLIN.
» click here to access presentation

In brief
  • Project start: 1st March 2021
  • Project end: 29th February 2023
  • Active partner
Project partner - MERLIN
  • Berg & Co. GmbH Spanntechnik
  • CP contech electronic GmbH
  • Fraunhofer Institute for Mechatronic Systems Design
  • Lenze SE
  • steute Technologies GmbH & Co. KG
  • OWL University of Applied Sciences and Arts
Get in touch?
Please contact us!

Julia Mönks
Productmanager MMI

+49 5731 745-455
j.moenks@steute-meditec.com

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